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Micro SIM Card Connector 8P,PUSH PULL,H2.4mm
Material:
Base:Hi-Temp Thermoplastic,UL94V-0.Black.
Data Contact:Copper Alloy,Gold Plated.
Shell:Stainless Steel,Gold Plated.
Electrical:
Contact Resistance:50mΩ typical,100Ω Max.
Insulation Resistance:>1000MΩ/500V DC.
3.Solderability
Vapor phase:215ºC.30sec.Max.
IR feflow:250ºC.5sec.Max.
Manual soldering:370ºC.3sec.Max.
Operating Temperature: -45ºC~+105ºC |
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