|
 |
Micro SIM Card Connector,6P＋1P,PUSH PUSH,H1.85mm,Reverse MID Mount
Material:
Insulator:High Temperature Thermoplastic,UL94V-0,Black.
Contact:Copper Alloy.Plated 30u" Ni Overall,Solder Area:Tin,Contact G/F
Shell:Stainless,30u" Ni Overall Plated G/F Selective Contact Area.
Electrical:
Current Rating:0.5A max.
Voltage Rating:50V DC max.
Ambient Humidity Range:95% R.H. Max.
Contact Resistance:100mΩ Max.
Insulation Resistance:1000MΩ Min./250V DC
Dielectric Withstanding Voltage:500V AC
Mating Cycles:5000 Insertions
Operating Temperature: -45ºC~+85ºC |
| Picture |
Part No. |
PDF |
Description |
Order Qty. |
Time |
Order |
|
|
P-H1.5-R 金比莱_0.jpg)
