NOTES:
1.Material:
1-1.Housing: High Temperature Resistant Plastic,UL94 V-0.
1-2.Contacts: Copper Alloy
1-3.Mid Plate: Stainless Steel
1-4.Front Shell: Stainless Steel
2.Plating Specification:
2-1.Contacts: Ni 50u" Min.Under Plated Over All
Au Plated On The Functional Area Of Contact
Au Plated On The Solder Area
2-2.Front Shell: Ni 30u"Min.Under Plated Over All.
2-3.Mid Plate: Clear Only
3.Mechanical:
3-1.Insertion Force: 0.5~2.0kgf
3-2.Removal Force: 0.8kgf~2.0kgf
3-3.Durability: 10000 Cycles
4.Electrical:
4-1. Voltage Rating: 5 VDC/AC (RMS. Max)
Current Rating: 15AMPS Min For VBUS Pin,
0.25 AMPS. For All Other Contact.
4-2.LLCR: Vbus & GND Pins And Other Pins: 40mΩ/Pin Max
Shield: 50mΩMax
LLCR Max.Change Of All Pins: 10mΩ
4-3.Insulation Resistance: 100M Min
4-4.Dielectric Withstand Voltage: AC 100V For 1Minute
5.Operating Temperature: -25℃+85℃
6.IR Reflow: The Peak Temperature On The Board Shall Be
Maintained For 10 Seconds At 260℃