2.PLATING:
Contact:Contact Area:Au G/F,
Solder Area Matte Tin 80u"Min ;
Under Plate Ni 40u"Min All Over
Shell: Solder Area:Au G/F,Under Plate Ni 50u"Min All Over
CD PIN: Contact Area:Au G/F,Under Plate Ni 50u"Min All Over
3.Electric:
Rated Current:1.0A
Rated Voltage:30V
Contact Resistance:50mΩ Max
Insulation Resistance:1000MΩ Min 500V DC
Dielectric Withstanding Voltage: 500V AC.
Solder Ability:255±5°C,5±0.5s.
Durability:10000 Cycles Min.
Operating Condition:Temperature-40°C~+85°C
Humidity 80% R.H Max
